The rapid growth in semiconductor technology and AI/HPC applications is driving the demand for high-performance chips, resulting in higher power density in data centers. As the heat generated by these powerful chips increases, traditional cooling methods are becoming less effective. To address this, Ingrasys established a 'High-Efficiency Cooling Laboratory’ years ago, offering a comprehensive range of customized rack-level liquid and immersion cooling solutions for various scenarios. These solutions not only manage the increased computational demands but also reduce energy consumption and operational costs, making data centers greener and more efficiently.