Immersion cooling eliminates the need for fans, enabling components to be placed much closer together and allowing for more compact and densely packed configurations in data centers.

Immersion cooling offers an optimal cooling capacity and a much lower PUE because the entire component surface is in contact with the cooling medium, which reduces the risk of hotspots in high-density computing environments.

The modular tank-based design features customized chamber size, allows for rapid deployment regardless of location. This is particularly beneficial in environments with space constraints or high computational demands.

With all components are immersed in the fluid, the system operates silently, leading to a data center environment free from acoustic noise and vibration impact.